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wafer level packaging meaning in Chinese

晶圆级封装

Examples

  1. Novel alignment technologies for wafer level packaging
    圆片级封装的新颖对准技术
  2. Formation of electroplated solder bumps in wafer level packaging
    焊料凸点制作工艺
  3. A novel package for microelectronics : wafer level package
    圆片级封装
  4. Lead - free solder bumping technology for wafer level package
    圆片级封装的无铅焊料凸点制作技术研究

Related Words

  1. wafer
  2. wafer grain
  3. sliced wafer
  4. wafer patterning
  5. wafer map
  6. wafer separator
  7. wafer flat
  8. wafer yield
  9. wafer tray
  10. wafer printing
  11. wafer lapping
  12. wafer level
  13. wafer level reliability
  14. wafer level reliability test
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